Smart Cyber-Physical Systems

Europe has a strong market position in electronics, microsystems and embedded system. The objective is to reinforce this position addressing the broad range of system integration from components to cyber-physical systems.

Next generation embedded ICT systems are interconnected and collaborating including through the Internet of things, and providing citizens and businesses with a wide range of innovative applications and services in living and working environments. Cyber-Physical Systems (CPS) need to comply with essential requirements like safety, security and near-zero power consumption as well as size, usability and adaptability.

Work is complementary to the activities addressed by the Electronic Components and Systems Joint Undertaking (ECSEL), which are focussed on large scale federating projects and integrated demonstrations and pilots.

Scope of the activities

H2020 calls for research and innovation actions focus in two specific areas:

  • Modelling and integration frameworks,
  • Smart, cooperative and open CPS.

Projects are expected to be driven by industrial requirements, to be well balanced between industry and academia, and to include a demonstration and validation phase with realistic use cases.

The innovation actions will connect innovators across diferent value chains, in two themes:

  • Towards platforms and ecosystems: support will go to the development of reference architectures and platforms for open and cooperative CPS,
  • Towards a ‘smart everywhere’ society: the objective is the establishment of European networks of embedded systems design centres, helping businesses to improve the quality of their products and services with innovative embedded ICT components and systems.

Impact

The expected impact consists of a strong reduction by 30% of the development time for CPS, together with a stronger collaboration across value chains. It will result on developing a competitive offer for next generation core ICT platforms in Europe.

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