With the second Key Digital Technologies call currently open, this questionnaire aims to collect information about barriers to participation from the perspective of potential applicants.
The Chips Act, now going through its adoption process, promises to deliver a fundamental change to the European semiconductor ecosystem. This open event gave stakeholders an overview of the current status of the proposal and the opportunity to ask questions.
This online workshop will explore silicon photonics in the context of the Key Digital Technologies Joint Undertaking (KDT JU).
Download and read documents relating to the European Chips Act, including the Communication, Recommendation, Regulation and Joint Undertaking
Read about the key parts of the European Chips Act in this factsheet.
All the information you need to apply for the DIGITAL call on secretarial support for the two digital Industrial Alliances
EVP Vestager and Commissioner Breton discuss semiconductor policies with leading companies and research organisations.
The European Commission has kick-started two new Industrial Alliances: the Alliance for Processors and Semiconductor technologies, and the European Alliance for Industrial Data, Edge and Cloud.
This proposal covers nine institutionalised European partnerships based on Article 187 of the Treaty on the Functioning of the European Union, establishing individual joint undertakings for their implementation.
The Commission has proposed to set up 10 new European Partnerships between the European Union, Member States and/or the industry. The goal is to speed up the transition towards a green, climate neutral and digital Europe, and to make European industry more resilient and competitive. The EU will provide nearly €10 billion of funding that the partners will match with at least an equivalent amount of investment.
The Commission announced a new partnership aimed at reinforcing Europe’s innovation potential, boosting its competitiveness and ensuring technological sovereignty in the field of electronics.
The Digital Innovation Hub PULSATE has launched an open call for proposals in the field of Laser-Based Advanced Additive Manufacturing (LBAAM) technologies.
Key Digital Technologies underpin all digital systems, and include electronic and photonic components, and the software that defines how they work.
The Commission is welcoming a joint declaration by 22 EU Member States on processors and semiconductor technologies, discussed at the Video conference of the Ministers of Telecommunications this morning . Through their declaration, the Member States will commit to work together to bolster Europe’s electronics and embedded systems value chain and strengthen leading-edge manufacturing capacity, in view of reinforcing Europe’s capabilities in semiconductor technologies and offering the best performance for applications in a wide range of sectors.
The signatory Member States agree to work together in order to bolster Europe’s electronics and embedded systems value chain.
Our Digital Future is now! EFECS is the international forum along the Electronic Components and Systems value chains in Europe. This year EFECS is going to inspire you virtually, by providing the means to meet online, learn, discover and shape Our Digital Future together.
In a major effort to improve existing skills and training in new ones, the European Commission is launching a Pact for Skills.
This study presents a roadmap of the emerging technologies impacting the global electronic value chain. It also identifies the main emerging Micro-Nano Electronics (MNE), Smart Systems and Cyber-Physical Systems (CPS) technologies and forecasts their economic impact in short and midterm on the different end-user segments. It assesses which of these technologies are the most critical technologies for the EU and are therefore suggested to be supported by the European Commission and the follow-up Joint Undertaking in the context of Horizon Europe.
A webinar to present the new call for medical technologies, digital tools and artificial intelligence solutions was organised on 20 May 2020.
This one-day workshop will gather some of Europe’s leading partners in Photonic Integrated Circuit (PIC) technologies, from research through to pilot line manufacturing and industrialisation, covering all Technology Readiness Levels (TRLs).
