package microelectromechanical systems

Description

Integrate the microelectromechanical systems (MEMS) into microdevices through assembly, joining, fastening, and encapsulation techniques. Packaging allows for the support and protection of the integrated circuits, printed circuit boards, and associate wire bonds.

Alternative label

  • MEMS packaging

  • integrate microelectromechanical systems

  • integrate MEMS

  • integrating microelectromechanical systems

  • integrating MEMS

  • MEMS integrating

  • microelectromechanical systems packaging

  • package microelectromechanical systems

  • microelectromechanical systems integrating

  • packaging MEMS

  • packaging microelectromechanical systems

Skill type

  • skill

Skill reusability level

  • occupation specific skills and competences

Broader skills/competences

Optional Knowledge

Essential skill/competence of

Status

released

Concept URI

http://data.europa.eu/esco/skill/dc13a28b-39fd-4090-9e66-53a6003445a5