assemble microelectromechanical systems

Description

Build microelectromechanical systems (MEMS) using microscopes, tweezers, or pick-and-place robots. Slice substrates from single wafers and bond components onto the wafer surface through soldering and bonding techniques, such as eutectic soldering and silicon fusion bonding (SFB). Bond the wires through special wire bonding techniques such as thermocompression bonding, and hermetically seal the system or device through mechanical sealing techniques or micro shells. Seal and encapsulate the MEMS in vacuum.

Alternative label

  • microsystems assembling

  • MEMS assembling

  • microelectromechanical system assembling

  • assembling microsystems

  • assembling MEMS

  • microelectromechanical systems assembling

  • assemble MEMS

  • assembling microelectromechanical systems

Skill type

  • skill

Skill reusability level

  • sector specific skills and competences

Broader skills/competences

Narrower skills/competences

Optional Knowledge

Essential skill/competence of

Optional skill/competence of

Status

released

Concept URI

http://data.europa.eu/esco/skill/2c11a7eb-f1fc-4df6-909d-7aeff35ff1a4