The event gathered several key stakeholders from industry and research covering major part of the value chain, from components and technologies to products and solutions. It explored the needs and hurdles faced in Europe and provided insights into existing strengths, gaps and issues to be addressed in order to contribute to the resilience of key or strategic electronics value chains in Europe.
Several gaps and need for actions were identified, e.g. in the areas relating to, access to manufacturing foundries in Europe for prototyping and production; building strong investment cases for public funding, venture and other capital investments; support for design and prototyping activities, and common approaches to IPR, licencing, certification and standardisation and training.
The main recommendations put forward relate to: The establishment of a strong platform, including aggregation of capabilities to support foundries; Actions to provide access for innovative European companies to a broad set of technologies and production facilities; Support for research and development to address major technical challenges and achieve critical mass of design and prototyping; The allocation of an ambitious public and private investment, to strengthen industrial manufacturing technology transfer, application ecosystems and market reach.
Finally, more information on the discussion and outcome will be available very soon in the workshop report.
The objective of the workshop is to discuss with key stakeholders what sort of actions can be undertaken at European level to drive further innovation, including whether and how building up manufacturing capacity can benefit the community. The programme will consist of pitch presentations followed by open debate on key topics, the outcome of which will inform future EU workprogrammes and initiatives. The agenda will be available very soon.
The topics which will be covered relate to:
- Technology development and advancing innovation – structural electronics, wearables, smart textiles etc.;
- Access to manufacturing and upscaling the production process of flexible and printed electronics - Roll-to-Roll, Sheet-to-Sheet, Hybrid electronics, etc.
- Current strengths, market opportunities and emerging applications for flexible, printed and wearable electronics;
- Europe’s position in this domain - current limitations and challenges ahead - what can be done to better support the field.