A big step forward for electronics

A big step forward for electronics
Description

In the race for new markets, electronics manufacturers have to produce smarter and more streamlined devices. The 3D-HiPMAS project has found solutions to several technical problems to help European manufacturers take full advantage of this trend. The project team predict that the technology could save up to 50% or more of current production costs through labour, materials and energy savings, with more as it develops further.

 

 

Results

The 3D-HiPMAS project has developed new technology and plastics to help SMEs manufacture miniaturised electronic circuits on moulded plastics – paving the way for smart, innovative products.3D-HiPMAS has also led to a spin-off company, which is taking to market the project's techniques to integrate electronic circuits directly onto plastic parts. The commercial venture, S2P, launched in November 2014, opens the way for European companies to produce ever smaller, cheaper and smarter electronic devices. 

Programme name
Seventh Research framework programme (incl. Completion of sixth Research FP)
EC’s priorities
Jobs, Growth and Investment
EU contribution
€3 499 600
Project location
Germany
Time frame
2012 to 2015
Project webpage

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