Horizon 2020
The EU Framework Programme for Research and Innovation

AIRTEC 2017 - 12th International Aerospace Supply Fair "Sky High Innovations"

AIRTEC 2017 is the global B2B meeting and technology event for the aerospace supply chain. It will take place at the AeroExpoPark near Munich Airport (Germany) and will be structured aroud three main pillars: Congress, B2B meetings and Exhibition.
Date: 
From 24/10/2017 to 26/10/2017
Venue: 
AeroExpoPark, Munich
Organiser: 
AIRTEC

AIRTEC 2017 is the global B2B meeting and technology event for the aerospace supply chain. It will be structured aroud three main pillars: Congress, B2B meetings and Exhibition.

It will take place from October 24 until 26 in the AeroExpoPark, a new expanding event area, located near the international Airport Munich, Germany. In so doing, AIRTEC has followed the desire of the customers to attend the B2B-meetings of AIRTEC 2017 fast and time-saving. In only 20 minutes after landing at the international Airport Munich the B2B-meeting participant, procurement or technology manager will be at the booth of the exhibitor. A continuous shuttle service and VIP service will bring visitors and B2B-meeting participants during three days fast , comfortable and therefore time-saving and efficiently to the exhibitors of AIRTEC 2017.

This year not only buyers from OEMs and primes, but also from Airlines are invited. Also suppliers from different tiers are invited with their purchasing and R&D departments. The new venue „AeroExpoPark“ offers an event area over 100,000 m², where AIRTEC 2017 with big exhibition pavilions and numerous other pavilions for special exhibits, international conferences and catering, corresponding to air shows, will be presented. Up to 800 participants from 40 nations, among them numerous joints stands, are represented. Exhibitors come from all fields of the aerospace supply chain – from design, engineering up to materials, composites and metals furthermore to manufacturing, additive manufacturing, industry 4.0., digitalization. Electronics, sensors, testing, avionics, components and systems and life cycle support.

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