Draft Commission Delegated Directive amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages (7 pages + Annex 2 pages, in English)
Date of arrival: 2018 February 20 - Final date for comments: 2018 April 21
DescriptionThis draft Commission Delegated Directive concerns an application specific and temporary exemption from the RoHS 2 (Directive 2011/65/EU) substance restrictions.
Fields of ActivityELECTRONICS
DOMESTIC AND COMMERCIAL EQUIPMENT. ENTERTAINMENT. SPORTS