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ICT 2010

NANOPACK: Nano Packaging Technology for Interconnect and Heat Dissipation

This is a technology or research stand, located in Zone R2 - ICT inside. Stand number: R2-02

NANOPACK, the nano packaging technology for interconnect and heat dissipation project, is looking at chip-based electronic devices.

The NANOPACK project researches nanotechnologies for new materials and processes to develop low-thermal-resistance interfaces and interconnects. Enabling new thermal management solutions for integrated circuit packaging, NANOPACK targets various applications, such as the microprocessor, automotive, telecom, aerospace and avionic high-power electronic industries. This exhibit will include demonstrations from four companies: IBM (BladeCenter for supercomputing), Bosch (electrical power-steering control unit), Thales (core processing unit for Airbus A380 and A400 aircraft), and FOAB (highly integrated cooling system using carbon nanotubes). Finally, the exhibit will display the test stands developed for characterising the new materials for their ultra-low thermal resistance.

Technical description


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