William Fornaciari is Associate Professor at Politecnico di Milano, Dipartimento di Elettronica, Informazione e Bioingegneria (DEIB). He published six books and over 160 papers in international journals and conference proceedings, collecting five best paper awards, one certification of appreciation from IEEE and holds two international patents on low power design solutions. Since 1993 he is member of program and scientific committees and chair of international conferences in the field of computer architectures, EDA and system-level design. Since 1997 has been involved in 13 EU-funded international projects and he has been part of the pool of experts of the Call For Tender No.964-2005 – WING – Watching IST INnovation and knowledge, studying the impact of FP5 and FP6 expenditure for the EC, in the perspective to support the identification of FP7 and Horizon2020 research directions.
In FP6 he participated to the IP WASP on wireless sensor networks. In FP7 he participated to the MULTICUBE project on design space exploration and has been workpackage leader for the IP COMPLEX project and Project Technical Manager of 2PARMA (ranked as a success story by the EC), contributing also to the Artemis SMECY project. Currently, still in FP7, he is project coordinator of the HARPA project (2013-2016) on run-time management to achieve dependable performance and Workpackage leader of the CONTREX project 2013-2016) on design of systems with mixed criticalities. He is also project reviewer for the European Commission and national research bodies in Europe. During the last 20 years he has worked as consultant for both management and technical issues for many ICT industries, gaining a relevant experience in technology transfer and product development. His current research interests include embedded systems design methodologies, real-time operating systems, energy-aware design of sw and hw, runtime management of resources, reconfigurable computing and cyber-physical systems, design and optimization of multi-core systems, NoC design and optimization, thermal/ageing reliability issues.