With better cooling as developed in the NANOPACK project, electronic components can be packed more densely and be operated at higher power levels. This strongly increases the energy efficiency of the systems by reducing the need for 'chillier' systems and limiting the waste of materials associated with lower density systems. The objective of the project was to exploit the newly enabled technologies by demonstrating several devices owning unprecedented thermal and electrical capabilities, in the fields of microprocessors, automotive, avionic and aerospace high-power electronics.
Improved thermal management solutions will have a strong impact on energy and manufacturing efficiencies, as well as on component reliability. NANOPACK ended in September 2011.