Communications Networks, Content and Technology
European Commission Directorate General

Electronic components and systems (nanoelectronics, smart systems & embedded systems) - Joint Technology Initiative

Electronic components and systems (nanoelectronics, smart systems & embedded systems) - Joint Technology Initiative


The Joint Technology Initiative (JTI) will contribute to the development of a strong and globally competitive electronics components and systems industry in the Union. It will focus on high Technology Readiness Levels (TRL), i.e. manufacturing and market-segments demonstrations. It will encompass micro-/nanoelectronics (ENIAC ETP), smart integrated systems (EPoSS ETP) and embedded systems (ARTEMIS ETP).It aims to:

  • keep Europe at the forefront of technology development, bridging the gap between research and exploitation, strengthening innovation capabilities and creating economic and employment growth in the Union;
  • align strategies with Member States to attract private investment and contribute to sound public finances by avoiding unnecessary duplication and fragmentation of efforts;
  • maintain and grow electronics manufacturing capability in Europe and secure a commanding position in design and systems engineering;
  • provide access for all stakeholders to a world-class infrastructure;
  • build a dynamic ecosystem involving innovative SMEs, strengthening existing clusters and nurturing the creation of new clusters in promising new areas.

The JTI will combine the ENIAC and ARTEMIS Joint Undertakings into the new ECSEL Joint Undertaking and simplify the modus operandi based on the past experience.


JTI on electronic components and systems (nanoelectronics, smart systems & embedded systems).Negotiate the Council Regulation on the ECSEL Joint Undertaking, set up and participate in the governance of the ECSEL Joint Undertaking.Coordinate with key decision-makers (European Technology Platforms, Member States, regions, industry associations and R&D&I actors in the field).


  • Risk of losing manufacturing capability of electronic components in Europe
  • Declining market share for European component makers
  • Fragmentation of efforts and unnecessary duplication
  • Exploding costs for R&D&I investments, in particular at higher TRLs


Full-Time Equivalent: 
3.00 full-time equivalent (FTE)

Collaboration with other DGs or agencies:

We envisage spending under the Horizon 2020 programme of the order of €250 ml (overall budget for the JTI - years 2014-15) . These are indicative figures to be confirmed by the budgetary process by the end of 2013.

Co-funding by Member States (and regions) - at least €1.2 billion over 2014-2024In-kind contribution by R&D&I actors - at least €1.7 billion over 2014-2024Networks of stakeholdersParticipation in high-level events

Components (Unit A.4)

Implementing Regulation

Implementing the Join Undertaking (JTI) on Electronic Components and Systems for European Leadership (ECSEL)

Timeframe: 2014




Baseline new approach
Target ECSEL Joint Undertaking operational(2014)


Structured and excellent multi-disciplinary industrial R&D&I in the domain of electronic components and systems

Timeframe: 2014-2020



Quality of results: number of peer reviewed publications from the ECSEL JU projects

Baseline New approach
Target 6 scientific publication per million €(2014-2024)

Innovation: number of patents per 10 M€ funding

Baseline New approach
Target at least 3 patents per 10 M€ funding(2014-2024)

Aligned strategies between R&D&I actors and funding bodies

Timeframe: 2014-2024



Strategic Research and Innovation Agenda with priorities for implementation by the ECSEL JU and commensurate with announced budgets

Baseline new approach
Target Publication of an strategy research agenda by the European Technology Platforms supporting ECSEL(2014-2024)

Mobilisation and pooling of resources

Timeframe: 2014-2020



Budget execution

Baseline Council Regulation (COM(2013) 501)
Target 1.2 B€ (EU) + 1.2 B€ (Member States) + 1.7 B€ (R&D&I actors)(2014-2024)

Manufacturing growth in Europe

Timeframe: 2014-2024



Direct and induced jobs in electronics sector

Baseline 1 000 000 jobs (HLG KET report 2011)
Target +250 000 jobs(2020)

Volume production of micro-/nanoelectronics manufacturing plants in Europe measured by technology node and wafer size

Baseline 225K wafer starts/month 12-inch equivalent (Yole Développement EMEA fabs database)
Target Double wafer starts/month(2020)

Leadership in equipment and materials

Timeframe: 2014-2020




Baseline Status 2013 (SEMI market reports)
Target Maintain status(2014-2020)

High TRL projects

Timeframe: 2014-2020



Pilot Lines

Baseline new approach
Target 3 new/upgraded pilot lines in Europe per year(2014-2024)


Baseline new approach
Target at least 3 demonstrators of integrated solutions per year(2014-2024)

Take-up of new technologies by European application sectors

Timeframe: 2014-2020



Take-up of new technologies by European application sectors

Baseline status 2013 (Market reports)
Target Increased exploitation of innovative solutions in Europe(2014-2024)

Strategic cooperation on embedded and smart systems

Timeframe: 2014-2020




Baseline status 2013 (market reports)
Target Increase market shares of electronic system suppliers(2014-2024)

Link to DG CONNECT's Top Level Targets

  • Europe 2020 - 3% of the EU's GDP should be invested in R&D, complemented by a future EU 2020 Headline Innovation Indicator
  • H2020 - By 2020, one third of all Europe's ICT business investment in ICT R&D in the EU should come from companies created within the last two decades